A customer manufacturing industrial control boards experienced intermittent failures during final testing. Several resistors showed open-circuit conditions after PCB depaneling, resulting in reduced production yield and increased rework costs.
JEC’s Analysis
Initial investigation revealed that the resistor values were normal before assembly, but some components became electrically open after soldering and depaneling.
JEC’s failure analysis identified the root cause as excessive mechanical stress applied to the PCB during depaneling and handling. The board flexing generated stress concentrations around the resistor body, causing cracks in the ceramic substrate and ultimately leading to open-circuit failures.
JEC Solution
To improve reliability, JEC worked closely with the client and implemented several corrective measures:
Optimized resistor structure with reinforced ceramic substrate and protective epoxy layer for improved bending strength
Recommended SMT placement pressure optimization to prevent excessive assembly stress
Provided PCB layout guidelines, including stress-relief spacing around critical resistor locations
Reduced mechanical impact during depaneling operations
The Result
After implementing the improvements, the client achieved:
Higher assembly yield
Improved long-term reliability
Reduced rework and maintenance costs
More stable production performance
At JEC (Dongguan Zhixu Electronics), we help customers identify root causes of passive component failures and provide reliable resistor and capacitor solutions for demanding applications.
Contact JEC today for failure analysis support, free samples, and component selection recommendations.
WhatsApp: Jeccisa +8613802381803
Email: jec888@jeccap.cn
WeChat: JECcapacitor
Post time: Jun-26-2026